Thermal Compound
Rosewill RCX-TC001
productDetail.noRatings
productDetail.specsAndOptions
Amount
200 g
Features
System builder value size contains enough compound for 500 applications | Resealable package | High thermal conductivity. | Low thermal resistance. | Non-corrosive. | Best thermal stability in high temperature. | Excellent adhesion. | Preserve in room temperature for longer lifespan. | Color: White | Specific Gravity @ 25°C: >2.5 | Dielectric Constant: >5.1 at 100Hz | Dissipation Factor: <0.005 at 100Hz | Temperature Stability (°C): -50 ~ 24°C | Thermal Conductivity (W/m-K): >1.22 | Net Weight: 200 grams / 0.44lbs
Manufacturer
Cooler Master
Model
IceFusion
Part Number
RG-ICFN-200G-B1
productDetail.priceDropAlert
productDetail.priceDropDesc
productDetail.signInAlert
productDetail.signInproductDetail.priceHistory
Loading price history...
Thermal Compound Alternatives
Explore other popular Thermal Compound options compatible with custom builds
