Thermal Compound
Arctic Silver 5 High-Density Polysynthetic Silver
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Amount
3.5 g
Features
Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. | Contains over 88% thermally conductive filler by weight.These thermally-enhanced ceramic particles improve the compound's performance and long-term stability | Ensure the best physical contact between the heatsink and the CPU core. | Will not separate, run, migrate, or bleed. | 3.5-gram | Average Particle Size: <0.49 micron <0.000020 inch | Extended Temperature Limits: Peak: -50 Degrees C to >180 Degrees C | Long-Term: -50 Degrees C to 130 Degrees C | Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. | Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003 thick, the 3.5 gram syringe will cover approximately 16 square inches.
Manufacturer
Arctic Silver
Model
5 High-Density Polysynthetic Silver
Part Number
AS5-3.5G | AS-AS5-35
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| productDetail.merchant | productDetail.price | productDetail.action |
|---|---|---|
 | $14.99 |
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